High temperature PCBA bonding flatness analysis
Application: UNEO Pressure Distribution Analyzer System has high resolution with sensor pitch as small as 0.5mm and great thermal stability (250℃). It can be used in PCBA bonding process and hotbar pressure distribution measurement. Also, the system can be used in measuring flatness in wafer or panel’s high temperature lamination process. The software displays real-time images to make timely tuning of the machine possible and increase production rate.