Lamination flatness analysis for display panels and wafer
Application: UNEO Pressure Distribution Analyzer System can be used in display panel and wafer manufacturing process to analyze the flatness of lamination.
For instance: Polarizer bonding, ACF sealant bonding, wafer lamination, etc. The system can further analyze the flatness of the surface which pressure is applied and display real-time images with the software included. This function will allow operators to know when tuning is needed on the spot, so production rate can be increased and labor cost and time cost can be reduced.