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UNEO PRESSURE DISTRIBUTION ANALYZER SYSTEM
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WAFER POLISHING FLATNESS ANALYSIS
WAFER POLISHING FLATNESS ANALYSIS
UNEO Pressure Distribution Analyzer System can be used in wafer polishing process to analyze the pressure distribution of the polishing head. The software displays real-time images to make timely tuning of the machine possible. Implementing the system can greatly increase the production rate, decrease the possibility of debris, and reduce costs such as labor cost and time cost.
