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BRUSH/WHEEL PRESSURE DISTRIBUTION ANALYSIS

UNEO Pressure Distribution Analyzer System can be used for the wafer and panel cleaner brushes and in wheel lamination process. It measures the pressure applied by wheels or brushes, and it analyzes the pressure distribution during wheel lamination process. The system can be used for calibrating brush pressure and wheel lamination flatness. The software can be used for overlay analysis to check the flatness of the wheel and timely tuning to increase production rate.